Huanghe Whirlwind Successfully Develops Polycrystalline Diamond Heat Sink Plates
November 27, 2024
Integrated circuits are a key strategic emerging industry for the country and a focal point in the technological competition between China and the United States. In recent years, with the rapid development of electronic device performance, efficiently conducting the heat generated by integrated circuit chips (such as CPUs and GPUs) has become extremely important for ensuring the continuous, stable, and smooth operation of systems. The silicon-dominated semiconductor field faces bottlenecks under conditions of high power density, high frequency, high temperature, and high radiation. Therefore, developing heat dissipation materials with high thermal conductivity has become a current research hotspot. In May 2024, Huanghe Whirlwind successfully developed CVD polycrystalline diamond heat sink plates. This product has a diameter of 2 inches, a thickness of 0.3 to 1 mm, and a thermal conductivity greater than 2000 W/m·K, reaching the theoretical thermal conductivity value of diamond. After double-sided polishing, the surface roughness is Ra < 4 nm, and the warpage is less than 2 μm, outperforming similar foreign products and achieving a leading level. Diamond possesses excellent thermal conductivity, extremely high electron mobility, and outstanding physical properties such as high pressure resistance, high-frequency performance, low cost, and high-temperature resistance, making it the material with...
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